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PRELIMINARY DATA SHEET
NEC's 13 GHz INPUT DIVIDE BY 4 PRESCALER IC UPB1513TU FOR SATELLITE COMMUNICATIONS
FEATURES
* OPERATING FREQUENCY: fin = 5 to 13 GHz * LOW CURRENT CONSUMPTION: ICC = 48 mA @ VCC = 5.0 V * HIGH-DENSITY SURFACE MOUNTING: 8-pin lead-less minimold * SUPPLY VOLTAGE: VCC = 4.5 to 5.5 V * DIVISION RATIO: 4
DESCRIPTION
NEC's UPB1513TU is a silicon germanium (SiGe) monolithic integrated circuit designed as a divide by 4 prescaler IC for satellite communications and point-to-point/multi-point radios. The package is 8-pin lead-less minimold suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) silicon bipolar process.
APPLICATIONS
* POINT-TO-POINT/ MULTI-POINT RADIOS * VSAT RADIOS
ORDERING INFORMATION
PART NUMBER UPB1513TU-E2 ORDER NUMBER UPB1513TU-E2-A PACKAGE 8-pin lead-less minimold (Pb-Free) Note MARKING 1513 SUPPLYING FORM * 8 mm wide embossed taping * Pin 5, 6, 7, 8 indicates pull-out direction of tape * Qty 5 kpcs/reel
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPB1513TU
California Eastern Laboratories
UPB1513TU INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS
(Top View)
1 2 3 4 1/2 1/2 Regulator 8 7 6 5 PIN NO. 1 2 3 4 5 6 7 8 PIN NAME VCC1 IN GND IN OUT GND OUT VCC2
SYSTEM APPLICATION EXAMPLE
LNA Down-Converter
PB1513TU
13 GHz Prescaler 1/4
Diplexer
PLL
PA
Up-Converter
UPB1513TU PIN EXPLANATION
PIN NO. 1 PIN NAME VCC1 APPLIED VOLTAGE (V) 5 Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance. 2 IN - Signal input pin. This pin should be coupled to signal source with capasitor (example : 100 pF) for DC cut. 3 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 4 IN - Signal input bypass pin. This pin must be equipped with bypass capacitor (example : 100 pF) to minimize ground impedance. 5 OUT - Divided frequency output pin. This pin shoud be coupled to load device with capasitor (example : 100 pF) for DC cut. 6 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 7 OUT - Divided frequency output pin. This pin should be coupled to load device with capasitor (example : 100 pF) for DC cut. 8 VCC2 5 Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance. FUNCTION AND APPLICATIONS
UPB1513TU ABSOLUTE MAXIMUM RATINGS
PARAMETER Supply Voltage Total Power Dissipation Thermal Resistance (junction to ground paddle) Operating Ambient Temperature Storage Temperature SYMBOL VCC PD Rth(j-c) TA Tstg TEST CONDITIONS TA = +25C TA = +85C
Note
RATINGS 6 867 75 -40 to +85 -55 to +150
UNIT V mW C/W C C
TA = +85C Note
Note
Mounted on 33 x 21 x 0.4 mm polyimide PCB, with copper patterning on both sides.
RECOMMENDED OPERATING RANGE
PARAMETER Supply Voltage Operating Ambient Temperature SYMBOL VCC TA MIN. 4.5 -40 TYP. 5.0 +25 MAX. 5.5 +85 UNIT V C
ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V, TA = -40 to +85C, ZS = ZL = 50 )
PARAMETER Circuit Current Input Sensitibity SYMBOL ICC Pin1 Pin2 Pin3 Output Power Pout TEST CONDITIONS No Signals fin = 5 to 6 GHz fin = 6 to 12 GHz fin = 12 to 13 GHz fin = 5 to 13 GHz, single ended, Pin = -5 dBm MIN. - -8 -8 -5 -11 TYP. 48 - - - -4 MAX. 75 -5 0 0 2 UNIT mA dBm dBm dBm dBm
UPB1513TU TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)
INPUT SENSITIVITY vs. FREQUENCY
15 10 Input Sensitivity Pin (dBm) 0 -5 -10 -15 -20 -25 -30 -35 0 5 10 Frequency f (GHz) VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V 15 20 Output Power Pout (dBm) 5
Guaranteed operating range
3 2 Pin = -5 dBm 1 0 -1 Guaranteed operating range -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 10 0 5
OUTPUT POWER vs. FREQUENCY
VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V 15 20
Frequency f (GHz)
15 10 Input Sensitivity Pin (dBm)
INPUT SENSITIVITY vs. FREQUENCY
VCC = 3.0 V Output Power Pout (dBm)
OUTPUT POWER vs. FREQUENCY
3 2 VCC = 3.0 V 1 Pin = -5 dBm 0 -1 Guaranteed operating range -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 10 0 5 Frequency f (GHz)
5 0 -5 -10 -15 -20 -25 -30 -35 0 TA = -40C TA = +25C TA = +85C 5
Guaranteed operating range
10 Frequency f (GHz)
15
20
TA = -40C TA = +25C TA = +85C 15 20
Remark The graphs indicate nominal characteristics.
UPB1513TU MEASUREMENT CIRCUITS
100 pF 5V Power Supply
10 nF
1 100 pF 50 2 3 4
VCC1 IN GND IN
VCC2 OUT GND OUT
8 7 6 5 50 100 pF
Signal Generator
100 pF 51
100 pF 51
Spectrum Analyzer
The application circuits and their parameters are for reference only and are not intended for actual design-ins.
UPB1513TU ILLUSTRATION OF THE MEASUREMENT CIRCUIT ASSEMBLED ON EVALUATION BOARD
100 pF 10 nF 1 2 3 4 8 7 6 5 100 pF 51 100 pF 100 pF
100 pF
51
Remarks 1. 33 x 21 x 0.4 mm double-sided copper-clad polyimide PCB 2. Back side: GND pattern 3. Solder plated on pattern 4. 5. represents cutout : Through holes
UPB1513TU PACKAGE DIMENSIONS
8-PIN LEAD-LESS MINIMOLD (UNIT:mm) (Top View)
2.00.1
(Bottom View)
(0.65) (0.65) (0.6) (0.3) 0.40.1 (0.35) (0.35) 0.160.05 0.40.1 (1.4)
8
7
6
5
5
6
7
8
(0.6)
(0.5) (0.5)
2.20.05
1
2
3
4
(0.25) (0.25)
0.125+0.1 -0.05
(0.6)
(0.35)(0.35)
2.00.1
4
(0.75)
3
(0.75)
2
1
0.50.03
UPB1513TU
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground terminals as short as possible. (4) Bypass capacitance must be attached to VCC line. (5) Exposed heat sink at bottom on package must be soldered to PCB RF/DC ground.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 120C or below : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below Condition Symbol IR260
Wave Soldering
WS260
Partial Heating
HS350
Caution
Do not use different soldering methods together (except for partial heating).
Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale.
01/04/05
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279
Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information.
Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
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